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Spontaneous and piezoelectric polarization charge effects on contact resistance in AlGaN/GaN HEMT structures

机译:自发和压电极化电荷对AlGaN / GaN HEMT结构中接触电阻的影响

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摘要

Ohmic contact resistance in AlGaN/GaN HEMT structures was investigated by using thermionic emission and tunneling theories. It was found that the spontaneous and piezoelectric polarization charges at a heterojunction effectively lower the specific contact resistance of ohmic electrodes. The lowering effect is enhanced at a thin AlGaN, and therefore, the calculated resistance for Ti contact to Al{sub}0.3Ga{sub}0.7N decreased from 53 Ωcm{sup}2 at a thickness of 30 nm to 5.5×10{sup}(-6) Ωcm{sup}2 at 2 nm when the donor concentration was 10{sup}18 cm{sup}(-3). This analysis indicated that the control of AlGaN thickness under the ohmic electrodes is one useful way to lower the contact resistance.
机译:利用热电子发射和隧穿理论研究了AlGaN / GaN HEMT结构中的欧姆接触电阻。发现异质结处的自发极化和压电极化电荷有效地降低了欧姆电极的比接触电阻。在较薄的AlGaN薄膜上,降低效果得到了增强,因此,Ti与Al {sub} 0.3Ga {sub} 0.7N接触时的计算电阻从53Ωcm{sup} 2(厚度为30 nm)降低到5.5×10 {当供体浓度为10 {sup} 18 cm {sup}(-3)时,在2 nm处的sup}(-6)Ωcm{sup} 2。该分析表明,控制欧姆电极下的AlGaN厚度是降低接触电阻的一种有用方法。

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