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Comparison of measurement methods of interface trap density for n-MOSFETs with Si-implanted gate-SiO{sub}2

机译:硅注入栅SiO {sub} 2的n-MOSFETs界面陷阱密度测量方法的比较

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摘要

Effects of channel B-implantation before gate oxidation and heavy Si-implantation into the gate-SiO{sub}2 on interface trap density D{sub}(it) distribution in the energy gap for n-MOSFETs are analyzed by the following three different measurement methods; (I) high-low frequency capacitance, (II) subthreshold current, and (III) charge pumping. These threee methods produce the similar results of D{sub}(it). They indicate that the channel B{sup}+-dose scarcely has much effect on D{sub}(it) at midgap and increases as the larger amount of Si-dose gives the increase of the D{sub}(it). The method I can provide D{sub}(it) distribution across the majority of the bandgap and may cause an underestimation of D{sub}(it). The method II is convenient with a reasonable accuracy due to the simple DC measurement.
机译:通过以下三种不同的分析方法,分析了栅极氧化前的沟道B注入和向栅极SiO {sub} 2中大量注入Si对n-MOSFET的能隙中界面陷阱密度D {sub}(it)分布的影响。测量方法; (I)高低频电容,(II)亚阈值电流和(III)电荷泵浦。这三种方法产生与D {sub}(it)类似的结果。他们表明通道B {sup} +-剂量对中间隙的D {sub}(it)几乎没有影响,并且随着Si-剂量的增加而增加D {sub}(it),其增加。我可以在大部分带隙中提供D {sub}(it)分布的方法,并且可能导致D {sub}(it)的低估。由于简单的直流测量,方法II方便且精度合理。

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