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Comparison of measurement methods of interface trap density for n-MOSFETs with Si-implanted gate-SiO{sub}2

机译:用Si注入门-SIO {Sub} 2的N-MOSFET接口捕集密度测量方法的比较

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摘要

Effects of channel B-implantation before gate oxidation and heavy Si-implantation into the gate-SiO{sub}2 on interface trap density D{sub}(it) distribution in the energy gap for n-MOSFETs are analyzed by the following three different measurement methods; (I) high-low frequency capacitance, (II) subthreshold current, and (III) charge pumping. These threee methods produce the similar results of D{sub}(it). They indicate that the channel B{sup}+-dose scarcely has much effect on D{sub}(it) at midgap and increases as the larger amount of Si-dose gives the increase of the D{sub}(it). The method I can provide D{sub}(it) distribution across the majority of the bandgap and may cause an underestimation of D{sub}(it). The method II is convenient with a reasonable accuracy due to the simple DC measurement.
机译:通过以下三种不同分析了在N-MOSFET的能量隙中浇筑栅极氧化和重型Si·{Sub} 2上的栅极氧化和重的栅极{sub} 2中的栅极氧化和重的Si-antim} 2之前的影响。 测量方法; (i)高低频率电容,(ii)亚阈值电流,和(iii)电荷泵。 这三个方法产生了D {sub}(它)的类似结果。 它们表明通道B {sup} + - 剂量几乎没有对Midgap的D {sub}(IT)有很大影响,随着较大量的Si-DeSe提供D {Sub}(IT)的增加。 方法I可以在大多数带隙中提供D {子}(IT)分布,并且可能导致低估D {sub}(它)。 由于简单的直流测量,方法II具有合理的精度。

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