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Potential of 600 V trench gate IGBT having lower on-state voltage drop than diodes

机译:600 V沟槽栅极IGBT的通态压降低于二极管的电势

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摘要

The trench gate structure has recently been widely introduced both for low-voltage 600V insulated-gate bipolar transistors (IGBTs) and high-voltage 4.5 kV IGBTs. The reason is because of the significant improvement that has been achieved in thetradeoff between device on-state voltage and switching speed.This paper outlines the ultimate limit design and characteristics of a next-generation trench gate IGBT, using a very thin substrate and a finer design rule in the trench gate IGBT. The proposed IGBT will realize a forward voltage drop even lower thanthat of a 600 V diode while retaining fast switching speed.
机译:最近,已为低压600V绝缘栅双极晶体管(IGBT)和高压4.5 kV IGBT广泛引入了沟槽栅结构。原因是由于器件导通电压和开关速度之间的折衷取得了显着改善。本文概述了使用非常薄的基板和更精细的衬底的下一代沟槽栅IGBT的极限设计和特性。沟槽栅IGBT中的设计规则。所提出的IGBT将实现正向电压降,甚至低于600 V二极管的正向电压降,同时保持快速的开关速度。

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