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Electrical properties of a silicon-based PT/PZT/PT sandwich structure

机译:硅基PT / PZT / PT夹心结构的电性能

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A silicon-based PbTiO3 /Pb(Zr0.53Ti0.47)O-3 /PbTiO3 (PT/PZT/PT) sandwich structure is prepared by a sol-gel method. The PT layers in the sandwich structure are used as seeding layers to improve the crystallization of the lead zirconate titanate (PZT) ferroelectric thin films. The maximum dielectric constant of about 950 is obtained at the coercive field 17 kV cm(-1), and the remnant polarization is 19 mu C cm(-2). The leakage current density is less than 5 x 10(-9) A cm(-2) when the applied voltage is below 200 kV cm(-1) Compared with the ferroelectric structures without and with only one PT seeding layer, the processing temperature is reduced greatly, while the electrical properties of the PZT films are further improved. [References: 16]
机译:通过溶胶-凝胶法制备了硅基PbTiO3 /Pb(Zr0.53Ti0.47)O-3 / PbTiO3(PT / PZT / PT)三明治结构。夹层结构中的PT层用作籽晶层,以改善锆钛酸铅(PZT)铁电薄膜的结晶。在矫顽场17 kV cm(-1)处可获得约950的最大介电常数,剩余极化为19μC cm(-2)。当施加电压低于200 kV cm(-1)时,漏电流密度小于5 x 10(-9)A cm(-2)与没有和仅具有PT籽晶层的铁电结构相比,处理温度PZT膜的电性能大大降低,同时PZT膜的电性能得到进一步改善。 [参考:16]

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