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Silicon-based PT/PZT/PT sandwich structure and method for manufacturing the same

机译:硅基PT / PZT / PT夹心结构及其制造方法

摘要

A silicon based PT/PZT/PT sandwich structure is disclosed. A dielectric layer is formed over a semiconductor substrate. The dielectric layer preferably comprises a silicon dioxide layer. A first and the second conductive films are sequentially formed over the dielectric layer. A first ferroelectric film is formed over the first and second conductive films. A second ferroelectric film is formed over the first ferroelectric film. A third ferroelectric film is formed over the second ferroelectric film. The resulting structure is annealed. A third and fourth conductive films are sequentially formed over the third ferroelectric layer. The third and fourth conductive films are patterned.
机译:公开了基于硅的PT / PZT / PT夹心结构。在半导体衬底上方形成介电层。介电层优选包括二氧化硅层。在介电层上方顺序形成第一导电膜和第二导电膜。在第一导电膜和第二导电膜之上形成第一铁电膜。在第一铁电膜上方形成第二铁电膜。在第二铁电膜上形成第三铁电膜。将所得结构退火。在第三铁电层上依次形成第三和第四导电膜。构图第三和第四导电膜。

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