Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI

摘要

This paper describes a wafer bonding process using a 50μm thick benzocyclobutene (BCB) layer which has vias and metal electrodes. The vias were fabricated by molding BCB using a glass mold. During the molding, worm-like voids grew between BCB and the mold due to the shrinkage of polymerizing BCB. They were completely removed by subsequent reflowing in N_2. After patterning Al on the reflowed BCB for the electrodes and via connections, bonding with a glass substrate was performed. Voidless bonding without damage in the vias and electrodes was achieved. Through the process, the control of the polymerization degree of BCB is important, and thus the polymerization degree was evaluated by Fourier transform infrared spectroscopy. The developed process is useful for the wafer-bonding-based integration of different devices, e.g. micro electro mechanical systems and large-scale integrated circuits.