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Mechanical properties of thin silicon films deposited on glass and plastic substrates studied by depth sensing indentation technique

机译:用深度感应压痕技术研究玻璃和塑料基板上沉积的硅薄膜的机械性能

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摘要

This work concerns the characterisation of mechanical properties of thin amorphous and microcrystalline silicon films deposited on glass and polyethylene terephthalate substrates. The film/substrate indentation response has been investigated from the near surface up to film/substrate interface using depth sensing indentation technique. The universal hardness, Vickers hardness, elastic modulus, fracture toughness and creep resistance of the studied films have been determined. Particular attention has been paid to the effects of the flexible viscoelastic-plastic substrate on the indentation response of the film/substrate system. (c) 2006 Elsevier B.V. All rights reserved.
机译:这项工作涉及沉积在玻璃和聚对苯二甲酸乙二酯基材上的非晶态非晶硅和微晶硅薄膜的机械性能的表征。已经使用深度感测压痕技术研究了从近表面到膜/基底界面的膜/基底压痕响应。确定了所研究薄膜的通用硬度,维氏硬度,弹性模量,断裂韧性和抗蠕变性。特别注意了柔性粘弹塑性基材对薄膜/基材体系压痕响应的影响。 (c)2006 Elsevier B.V.保留所有权利。

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