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A study on the influence of local doping in atomic layer deposited Al:ZnO thin film transistors

机译:原子层沉积Al:ZnO薄膜晶体管中局部掺杂的影响研究

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Local doping of Al:ZnO into a ZnO matrix was performed vertically at various positions in a thin film using atomic layer deposition, and its influence was investigated by analyzing thin film transistor (TFT) characteristics. The position specific dopant distribution in the films was confirmed by high resolution transmission electron microscopy. It was found that doping specific locations in the active channel layer of a TFT had a different impact on its electrical characteristics. When near the semiconductor/gate dielectric interface, doping had a significant impact on the mobility of the TFT devices, which showed a gradual recovery as the doped region was moved away from the interface. The original characteristics of the device were almost completely restored once the doped region was moved more than 15 nm away from the interface, and when moved further away the output characteristics portrayed a shift in threshold voltage white preserving all other electrical characteristics. Various doping concentrations were implemented in regions both near and far away from the interface to gain a better understanding of the phenomena. The experimental results given here imply that the geographical position of doping is as important as selecting a dopant material in the device optimization of TFTs.
机译:使用原子层沉积在薄膜中的各个位置垂直进行Al:ZnO局部掺杂到ZnO基体中,并通过分析薄膜晶体管(TFT)特性研究其影响。膜中的位置特定掺杂剂分布通过高分辨率透射电子显微镜确认。发现在TFT的有源沟道层中掺杂特定位置对其电特性具有不同的影响。当靠近半导体/栅极介电界面时,掺杂会对TFT器件的迁移率产生重大影响,随着掺杂区从界面移开,掺杂会逐渐恢复。一旦将掺杂区从界面移开超过15 nm,该设备的原始特性几乎可以完全恢复,并且当移开更远的距离时,输出特性说明阈值电压白色发生了变化,从而保留了所有其他电气特性。在靠近和远离界面的区域中实施了各种掺杂浓度,以更好地理解该现象。此处给出的实验结果表明,在TFT的器件优化中,掺杂的地理位置与选择掺杂剂材料一样重要。

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