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An Explicit Continuous Analytical Model for Gate All Around (GAA) MOSFETs Including the Hot-Carrier Degradation Effects

机译:包括热载流子退化效应在内的全栅(GAA)MOSFET的显式连续分析模型

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In this paper, an explicit and continuous analytical model including interfacial hot-carrier effects is developed for a deep submicron Gate All Around (GAA) MOSFETs. Explicit analytical expressions of the surface potential, drain current and transconductance are given for all operating modes. Exploiting this new device model, we have found that the incorporation of a high-k layer, Gate Stack (GS), between oxide region and gate metal leads to drain current enhancement, improved transconductance parameter and enhanced interfacial hot-carrier immunity. The developed approaches are verified and validated by the good agreement found with the 2D numerical simulations for wide range of device parameters and bias conditions. GS GAA MOSFET design can alleviate the critical problem and further improve the immunity of hot-carrier effects of GAA MOSFET-based circuits in the deep submicron working domain.
机译:在本文中,针对深亚微米栅极全能(GAA)MOSFET开发了包括界面热载流子效应的显式连续分析模型。给出了所有工作模式下表面电位,漏极电流和跨导的明确分析表达式。利用这种新的器件模型,我们发现在氧化物区域和栅极金属之间引入高k层栅极堆叠(GS)可以提高漏极电流,改善跨导参数并增强界面热载流子免疫力。通过广泛的器件参数和偏置条件的二维数值模拟发现的良好协议,对开发的方法进行了验证和验证。 GS GAA MOSFET设计可以缓解关键问题,并进一步提高基于GAA MOSFET的电路在深亚微米工作域中的热载流子效应的抗扰性。

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