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首页> 外文期刊>Journal of Materials Science Letters >Deterioration of aluminum induced crystallization of sputtered silicon by film stress
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Deterioration of aluminum induced crystallization of sputtered silicon by film stress

机译:铝由于膜应力而导致溅射硅结晶化的恶化

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摘要

Metal induced crystallization (MIC) technique has been largely investigated for low temperature poly-silicon (LTPS) thin film transistor or solar cell application [1-4]. Aluminum is one of the metals used for MIC process, and the crystallization temperature of amorphous silicon (a-Si) as low as 150 ℃ has been reported [5]. Although the mechanism for lowering the crystallization temperature of a-Si:H by its contact with certain metals is not well understood, three main kinds of driving forces have been proposed to explain the MIC effect: (1) the diffusion of atoms due to the concentration gradient (2) the internal free energy gradient between a-Si and c-Si atoms and (30 external strains such as applied electric field or film stress.
机译:对于低温多晶硅(LTPS)薄膜晶体管或太阳能电池应用,已经广泛研究了金属诱导结晶(MIC)技术[1-4]。铝是用于MIC工艺的金属之一,据报道非晶硅(a-Si)的结晶温度低至150℃[5]。尽管通过与某些金属的接触来降低a-Si:H的结晶温度的机理尚未广为人知,但已提出了三种主要的驱动力来解释MIC效应:(1)由于原子的扩散而引起的原子扩散。浓度梯度(2)a-Si和c-Si原子之间的内部自由能梯度和(30个外部应变,例如施加的电场或膜应力。

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