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Heat Flow and Defects in Semiconductors: Beyond the Phonon Scattering Assumption

机译:半导体中的热流和缺陷:声子散射假设之外

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It is universally accepted that defects in materials scatter thermal phonons, and that this scattering is the reason why defects reduce the flow of heat relative to the defect-free material. However, ab-initio molecular-dynamics simulations which include defect dynamics show that the interactions between thermal phonons and defects involve the coupling between bulk (delocalized) and defect-related (localized) oscillators. Defects introduce Spatially-Localized Modes (SLMs) which trap thermal phonons for dozens to hundreds of periods of oscillation, much longer than the lifetimes of bulk excitations of the same frequency. When a phonon traps in a SLM, momentum is lost and the decay of localized phonons does not depend on the origin of the excitation but on the availability of receiving modes. This strongly suggests that carefully selected interfaces and/or δ-layers can be used to predict and control the flow of heat.
机译:公认的是,材料中的缺陷会散射热声子,并且这种散射是缺陷相对于无缺陷材料而言会减少热量流动的原因。但是,包括缺陷动力学在内的从头开始的分子动力学模拟表明,热声子与缺陷之间的相互作用涉及体(离域)和与缺陷相关的(局域)振荡器之间的耦合。缺陷会引入空间局部模式(SLM),该模式会捕获热声子数十至数百个振荡周期,比相同频率的整体激发的寿命长得多。当声子陷于SLM中时,动量会损失,局部声子的衰减不取决于激发的起源,而取决于接收模式的可用性。这强烈表明,精心选择的界面和/或δ层可用于预测和控制热流。

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