首页> 外文会议>International Conference on Gettering and Defect Engineering in Semiconductor Technology >Heat Flow and Defects in Semiconductors: Beyond the Phonon Scattering Assumption
【24h】

Heat Flow and Defects in Semiconductors: Beyond the Phonon Scattering Assumption

机译:半导体中的热流和缺陷:超出声子散射假设

获取原文

摘要

It is universally accepted that defects in materials scatter thermal phonons, and that this scattering is the reason why defects reduce the flow of heat relative to the defect-free material. However, ab-initio molecular-dynamics simulations which include defect dynamics show that the interactions between thermal phonons and defects involve the coupling between bulk (delocalized) and defect-related (localized) oscillators. Defects introduce Spatially-Localized Modes (SLMs) which trap thermal phonons for dozens to hundreds of periods of oscillation, much longer than the lifetimes of bulk excitations of the same frequency. When a phonon traps in a SLM, momentum is lost and the decay of localized phonons does not depend on the origin of the excitation but on the availability of receiving modes. This strongly suggests that carefully selected interfaces and/or δ-layers can be used to predict and control the flow of heat.
机译:它普遍接受了材料散射热声子中的缺陷,并且这种散射是缺陷相对于无缺陷材料减少热量的原因。然而,包括缺陷动态的AB-Initio分子动态模拟表明,热声子和缺陷之间的相互作用涉及散装(分层)和缺陷相关(局部)振荡器之间的耦合。缺陷引入了空间局部化模式(SLM),该模式捕获了几十到数百个振荡的热声子,比相同频率的散装激励的寿命长得多。当SLM中的声子陷阱时,势头丢失,局部声子的衰减不依赖于激发的起源,而是对接收模式的可用性。这强烈建议仔细选择的接口和/或δ-层可用于预测和控制热量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号