Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package

摘要

A new wafer-level chip-scale package process for high-performance, low-cost packaging has been developed based on passivation with low dielectric constant. This process is simpler and shorter when using permanent photosensitive benzocyclobutene (BCB) compared with the conventional process. However, cracks nucleating on the BCB cause serious reliability problems. The major reasons for cracking of the BCB layer seem to be both thermal stress and a shortage of BCB cross-linking agent (cyclobutene). The stress was reduced by optimizing the thickness of the BCB layer and the underlying stress buffer layer. The BCB cracking resistance was improved by creating more cross-linking agent at the final curing process through modification of the photolithography processes.