Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder

摘要

Power electronics modules (> 100 A, > 500 V) are essential components for the development of electrical and hybrid vehicles. These modules are formed from silicon chips (transistors and diodes) assembled on copper substrates by soldering. Owing to the fact that the assembly is heterogeneous, and because of thermal gradients, shear stresses are generated in the solders and cause premature damage to such electronics modules. This work focuses on architectured materials for the substrate and on lead-free solders to reduce the mechanical effects of differential expansion, improve the reliability of the assembly, and achieve a suitable operating temperature (<175℃). These materials are composites whose thermomechanical properties have been optimized by numerical simulation and validated experimentally. The substrates have good thermal conductivity (>280 W m~(-1) K~(-1)) and a macroscopic coefficient of thermal expansion intermediate between those of Cu and Si, as well as limited structural evolution in service conditions. An approach combining design, optimization, and manufacturing of new materials has been followed in this study, leading to improved thermal cycling behavior of the component.