首页> 外文期刊>Journal of Electronic Materials >Composites of Core/Shell-Structured Copper-Phthalocyanine- Decorated TiO_2 Particles Embedded in Poly(Arylene Ether Nitrile) Matrix with Enhanced Dielectric Properties
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Composites of Core/Shell-Structured Copper-Phthalocyanine- Decorated TiO_2 Particles Embedded in Poly(Arylene Ether Nitrile) Matrix with Enhanced Dielectric Properties

机译:核/壳结构的铜酞菁修饰的TiO_2粒子嵌入介电性能增强的聚(亚芳基醚腈)基体中的复合材料

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Polymer-based composite films were prepared by employing core/shell-structured tetranitrophthalocyanine copper/titanium dioxide (TNCuPc-TiO_2) hybrid particles as fillers and poly(arylene ether nitrile)s (PEN) as polymer matrix. Core/shell-structured TNCuPc-TiO_2 hybrid particles were successfully synthesized through a facile solvothermal synthesis route. Compared with raw TiO_2, the dispersibility and interfacial compatibility between TNCuPc-TiO_2 hybrid particles and PEN matrix were observably improved because the TNCuPc decorated on the TiO_2 can interact with nitrile groups in PEN. Consequently, core/shell-structured TNCuPc-TiO_2 had a more significant enhancement effect on the properties of PEN. Although the mechanical strength was reduced to 41 MPa, all of the composite films exhibited excellent thermal stability. Their initial decomposition temperatures were up to 510℃, and the glass-transition temperatures were over 191℃. More importantly, the permittivity of the composite film was as high as 19.8 at 100 Hz when the weight fraction of TNCuPc-TiO_2 hybrid particle loading reached 40.0 wt.%. Compared with the permittivity of PEN/TiO_2 composite films with 40.0 wt.% raw TiO_2 particle loading, the dielectric constant was increased by 161%.
机译:以核/壳结构的四硝基酞菁铜/二氧化钛(TNCuPc-TiO_2)杂化粒子为填充材料,以聚(亚芳基醚腈)(PEN)为聚合物基体制备了聚合物基复合膜。核/壳结构的TNCuPc-TiO_2杂化粒子是通过一种简便的溶剂热合成路线成功合成的。与未加工的TiO_2相比,由于在TiO_2上修饰的TNCuPc可以与PEN中的腈基相互作用,因此TNCuPc-TiO_2杂化颗粒与PEN基质之间的分散性和界面相容性得到了明显改善。因此,核/壳结构的TNCuPc-TiO_2对PEN的性能具有更显着的增强作用。尽管机械强度降低至41MPa,但是所有复合膜均表现出优异的热稳定性。它们的初始分解温度高达510℃,玻璃化转变温度超过191℃。更重要的是,当TNCuPc-TiO_2杂化颗粒负载的重量分数达到40.0 wt。%时,复合膜在100 Hz时的介电常数高达19.8。与具有40.0 wt。%原始TiO_2颗粒负载的PEN / TiO_2复合膜的介电常数相比,介电常数提高了161%。

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