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首页> 外文期刊>Journal of materials science >Decoration of reduced graphene oxide with dandelion-like TiO_2 and their dielectric properties in poly(arylene ether nitriles) composites
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Decoration of reduced graphene oxide with dandelion-like TiO_2 and their dielectric properties in poly(arylene ether nitriles) composites

机译:蒲公英样TiO_2修饰的氧化石墨烯的修饰及其在聚(亚芳基醚腈)复合材料中的介电性能

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摘要

Novel dandelion-like titanium oxide (TiO_2) decorated reduced graphene oxide (rGO@TiO_2) hybrids were obtained by a one-step solvent-thermal reduction of GO and tetrabutyl titanate simultaneously. The hybrids were used as a novel filler for high performance poly(ar-ylene ether nitriles) (PEN) composites. The thermal stability and morphological properties of the PEN composites were, respectively, investigated by the thermo gravimetric analysis and scanning electron microscope, aiming at examining the effect of surface decoration on the dispersion of rGO@TiO_2 in PEN matrix. The results indicated that the rGO@TiO_2 present better dispersion in the PEN matrix. Meanwhile, the derived composite films exhibited high thermal stability with initial decomposition temperatures (T_(id)) in the range of 477-487 ℃. DSC curves showed that the glass transition temperatures were in the range of 219-227 ℃. Moreover, all of the composite films also showed excellent flexibility and mechanical properties. The tensile modulus and strength were increased about 4 and 6 % with 5 wt% rGO@TiO_2 loading, respectively. More importantly, for 30 wt% rGO@TiO_2 reinforced PEN composite film, the dielectric permittivity dramatically increased from 3.8 to 81 at 1 kHz.
机译:通过一步一步溶剂热还原GO和钛酸四丁酯,获得了新型蒲公英样氧化钛(TiO_2)修饰的还原氧化石墨烯(rGO @ TiO_2)杂化物。该杂化物用作高性能聚(亚芳基醚腈)(PEN)复合材料的新型填料。通过热重分析和扫描电子显微镜分别研究了PEN复合材料的热稳定性和形貌性能,旨在研究表面装饰对rEN @ TiO_2在PEN基体中分散的影响。结果表明,rGO @ TiO_2在PEN基体中具有较好的分散性。同时,衍生的复合膜表现出高的热稳定性,其初始分解温度(T_(id))在477-487℃范围内。 DSC曲线表明,玻璃化转变温度在219-227℃之间。此外,所有复合膜还显示出优异的柔韧性和机械性能。当rGO @ TiO_2负载为5wt%时,拉伸模量和强度分别增加约4%和6%。更重要的是,对于30 wt%的rGO @ TiO_2增强PEN复合膜,介电常数在1 kHz时从3.8急剧增加到81。

著录项

  • 来源
    《Journal of materials science》 |2014年第11期|5051-5059|共9页
  • 作者单位

    Research Branch of Advanced Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu 610054, People's Republic of China;

    Research Branch of Advanced Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu 610054, People's Republic of China;

    Research Branch of Advanced Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu 610054, People's Republic of China;

    Research Branch of Advanced Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu 610054, People's Republic of China;

    Research Branch of Advanced Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu 610054, People's Republic of China;

    Research Branch of Advanced Functional Materials, Institute of Microelectronic and Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu 610054, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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