A study on the conduction path in undoped polycrystalline diamond films

摘要

The conduction path in as-grown undoped diamond films deposited by chemical vapor deposition has been investigated b employing impedance spectroscopy, electroplating and electroetching. The thickness- and direction-dependencies of electrical resistivity did not agree with the previously known surface conduction model. The Cu electroplating and Ag electroetching result showed that the current path followed the grain boundaries within the diamond films. The Cu electroplating of diamond film wit an insulating surface layer also showed that the grain boundaries within the films were the main conduction path in undoped polycrystalline films.