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The Conduction Mechanisms in Undoped Polycrystalline Diamond Films

机译:未掺杂多晶金刚石薄膜中的导电机理

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The undoped polycrystalline diamond films are deposited on p-type silicon substrates by a microwave plasma chemical vapor deposition (MPCVD) system. The deposition conditions are CH_4/H_2=0.5percent, pressure = 45 torr, power = 2.2 kW, and subtract temperature = 885 deg C. SEM was used to inspect the surface morphology, Raman Spectrosopy to determine the quality, and XPS to analyze the chemical composition. It is concluded that a cleaning procedure on diamond surfaces can eliminate the carbon phase but enhance the oxygenation on the films. The electrical characteristics were investigated by current-voltage-temperature measurements in a metal-insulator-semiconductor (MIS) structure with top metal contacts and back silicon substrates contacts. It can be found a transition electric field of 240 kV/cm, where Schottky emission (SE) mechanism is responsible for electric conductio below 240 kV/cm, and Poole-Frenkel transport (PF) mechanism dominates beyond 240 kV/cm. By the extrapolations, the Schottky barrier height of silver and diamond film is 2.4 eV, and the tarp depth is 4.75 eV in the diamond film.
机译:通过微波等离子体化学气相沉积(MPCVD)系统将未掺杂的多晶金刚石膜沉积在p型硅衬底上。沉积条件为CH_4 / H_2 = 0.5%,压力= 45 torr,功率= 2.2 kW,减去温度= 885摄氏度。使用SEM检查表面形貌,使用拉曼光谱仪确定质量,使用XPS分析化学成分。结论是,在金刚石表面上进行清洁程序可以消除碳相,但可以增强薄膜上的氧合作用。通过在具有顶部金属触点和背面硅衬底触点的金属-绝缘体-半导体(MIS)结构中的电流-电压-温度测量来研究电特性。可以发现240 kV / cm的过渡电场,其中肖特基发射(SE)机制负责低于240 kV / cm的电导率,而普尔-弗伦克尔输运(PF)机制在240 kV / cm以上起主导作用。通过外推,银膜和金刚石膜的肖特基势垒高度为2.4 eV,金刚石膜的篷布深度为4.75 eV。

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