Vacuum sealing using surface activation bonding of Si wafer

摘要

Bonding technology of Si wafer for vacuum seal is important in MEMS. We have tried the vacuum seal using surface activation bonding without any binder. It is the ultimate bonding technique and gives the precise dimension due to the direct contact. The technique is, however, not easy. We have investigated the surface conditions in order to achieve the bonding. The surfaces cleaned by Ar ion beam bombardment were measured by XPS and AFM. The natural oxide on the Si surface was removed by Ar ion bombardment. The surface roughness depended on the condition and the irradiation time of the Ar ion beam. The surface bonding at room temperature was achieved for the clean surface of the surface roughness less than Ra = 1 nm, but it was not done with the rough surfaces more than Ra > 2 nm. The vacuum sealing was checked using the cavities made in the Si wafer. The cavity part seated in vacuum was depressed in the atmosphere, which was measured using a needle-contact profiler and a 3D laser profiler. The gas in the cavity was measured with a mass spectrometer by clashing the seal in vacuum. Any other gas except Ar gas closed in the cavity was not detected. We concluded that the vacuum sealing using surface activation bonding of Si wafer was achieved. The sealing condition has not changed even after one year.