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Growth process from amorphous GaN to polycrystalline GaN on Si (111) substrates

机译:Si(111)衬底上从非晶GaN到多晶GaN的生长过程

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摘要

Amorphous GaN (a-GaN) films on Si (111) substrates have been deposited by RF magnetron Sputtering with GaN powder target. The growth process from amorphous GaN to polycrystalline GaN is studied by XRD, SEM, PL and Raman. XRD data mean that annealing under flowing ammonia at 850-950 degrees C for 10 min converts a-GaN into polycrystalline GaN (p-GaN). The growth mechanism can be mostly reaction process through N3- in amorphous GaN replaced by N3- of NH3. Annealing at 1000 degrees C, the appearance of GaN nanowires can be understood based on the vapor-liquid-solid (VLS) mechanism. In addition, XRD, PL and Raman measurement results indicate that the quality of GaN films increases with increasing temperature. The tensile stress in the films obtained at 1000 degrees C is attributable to the expansion mismatch between GaN and Si, with the gallium in tile film playing a negligible role.
机译:通过用GaN粉末靶进行RF磁控溅射在Si(111)衬底上沉积了非晶GaN(a-GaN)膜。通过XRD,SEM,PL和Raman研究了从非晶GaN到多晶GaN的生长过程。 XRD数据表示,在850-950摄氏度的氨流中退火10分钟,即可将a-GaN转换为多晶GaN(p-GaN)。生长机理主要是通过非晶态GaN中的N3-被NH3的N3-代替的反应过程。在1000摄氏度下进行退火,可以基于气液固(VLS)机理了解GaN纳米线的外观。此外,XRD,PL和拉曼测量结果表明,GaN膜的质量随温度升高而提高。在1000摄氏度下获得的薄膜中的拉伸应力归因于GaN和Si之间的膨胀失配,瓷砖薄膜中的镓的作用可忽略不计。

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