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Ge1Sb2Te4 based chalcogenide random access memory array fabricated by 0.18-mu m CMOS technology

机译:采用0.18微米CMOS技术制造的基于Ge1Sb2Te4的硫族化物随机存取存储器阵列

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摘要

Ge1Sb2Te4-based chalcogenide random access memory array, with a tungsten heating electrode of 260 nm in diameter, is fabricated by 0.18-mu m CMOS technology. Electrical performance of the device, as well as physical and electrical properties of Ge1Sb2Te4 thin Elm, is characterized. SET and RESET programming currents are 1.6 and 4.1 mA, respectively, when pulse width is 100 ns. Both the values are larger than those of the Ge2Sb2Te5-based ones with the same structure and contact size. Endurance up to 106 cycles with a resistance ratio of about 100 has been achieved.
机译:基于Ge1Sb2Te4的硫族化物随机存取存储器阵列是通过0.18微米CMOS技术制造的,其直径为260 nm的钨加热电极。表征了器件的电气性能以及Ge1Sb2Te4薄榆木的物理和电气性能。当脉冲宽度为100 ns时,SET和RESET编程电流分别为1.6和4.1 mA。这两个值均大于具有相同结构和接触尺寸的基于Ge2Sb2Te5的值。已经实现了高达106个循环的耐力和大约100的电阻比。

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