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Composition, structure and mechanical property analysis of DC sputtered C-Ni and CNx-Ni nano-composite layers

机译:直流溅射C-Ni和CNx-Ni纳米复合层的组成,结构和力学性能分析

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Carbon-nickel (C-Ni) and carbon-nitride-nickel (CNx-Ni) films were deposited onto native SiO2 covered Si substrates by DC magnetron sputtering from a graphite-nickel composite target using Ar or N-2 for sputtering at about 2.6 Pa. The substrate temperature varied between 25 and 800degreesC. The structure, composition and mechanical properties of C-Ni and CNx-Ni thin layers (200-300 nn) have been investigated by high-resolution transmission electron microscopy (HRTEM), XPS, nano-indentation and nano-scratch techniques. The layers were predominantly crystalline irrespective of their deposition conditions. At low deposition temperature, up to 200degreesC, the columnar crystallites were identified as hexagonal Ni3C, separated by narrow 'walls' of amorphous carbon. At substrate temperatures above 400degreesC, however, a graphitic multilayer arrangement of the carbon matrix was developed around the nano-crystalline cubic nickel-nickel carbide islands. The mechanical properties of the films varied also significantly with the deposition temperature. The highest nano-hardness of about 14 GPa was measured for the film grown at 200degreesC, while lower values (2-4 GPa) were obtained for high-temperature films. High hardness values were related to the presence of Ni3C. The lowest friction coefficients were obtained for films containing high amounts of multi-layered graphite-like carbon developed at intermediate deposition temperatures. Copyright (C) 2004 John Wiley Sons, Ltd.
机译:通过直流磁控溅射从石墨-镍复合靶上溅射碳-镍(C-Ni)和氮化碳-镍(CNx-Ni)膜到天然SiO2覆盖的Si基板上,使用Ar或N-2进行约2.6溅射Pa。基板温度在25至800摄氏度之间变化。通过高分辨率透射电子显微镜(HRTEM),XPS,纳米压痕和纳米划痕技术研究了C-Ni和CNx-Ni薄层(200-300 nn)的结构,组成和力学性能。不论其沉积条件如何,这些层主要为晶体。在低沉积温度(最高200摄氏度)下,柱状微晶被鉴定为六方晶Ni3C,被非晶碳的狭窄“壁”隔开。然而,在高于400℃的基板温度下,碳基质的石墨多层排列在纳米晶立方镍-碳化镍岛周围形成。膜的机械性能也随沉积温度而显着变化。在200℃下生长的薄膜测得的最高纳米硬度约为14 GPa,而高温薄膜的测得的纳米硬度值较低(2-4 GPa)。高硬度值与Ni3C的存在有关。对于包含在中间沉积温度下显影的大量多层类石墨碳的薄膜,其摩擦系数最低。版权所有(C)2004 John Wiley Sons,Ltd.

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