High flexible and high thermal resistant nano-composite composition for forming insulation coating of circuit or metal layer deposited by sputtering in flexible printed circuit boards and manufacturing methode there of

摘要

The present invention relates to a high flexible and high thermal resistant nanocomposite composition suitable for forming an insulation coating on wiring of a flexible printed circuit board (FPCB) or a metal layer deposited by sputtering, and a manufacturing method thereof. By using inorganic powder, the composition has high printing properties and thermal resistance, and has excellent flexibility because insulation degradation problems according to property changes in the inorganic powder surface do not occur by surface treatment and bending resistance is not degraded.