首页> 外文期刊>Transactions of the Institute of Metal Finishing: The International Journal for Surface Engineering and Coatings >Mesmoproc - implementation of a maskless electrochemical surface modification process
【24h】

Mesmoproc - implementation of a maskless electrochemical surface modification process

机译:Mesmoproc-无掩模电化学表面改性工艺的实施

获取原文
获取原文并翻译 | 示例
           

摘要

Conventional approaches to the fabrication of fine features in the printed circuit board and metal finishing industries typically employ a multistage photolithography stage to process each individual substrate, which is both inefficient and wasteful of valuable materials. By developing and implementing a maskless electrochemical process that decreases the use of lithography, the Mesmoproc project aims to assist European industry in these sectors.
机译:在印刷电路板和金属涂饰工业中制造精细特征的常规方法通常采用多阶段光刻阶段来处理每个单独的基板,这既效率低下又浪费宝贵的材料。通过开发和实施可减少光刻使用的无掩模电化学工艺,Mesmoproc项目旨在在这些领域为欧洲工业提供帮助。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号