The SMART Group 25~(th) Anniversary Seminar

摘要

The advent of surface-mount component packaging in the early 1980s precipitated a step change in printed circuit assembly procedure and presented a new generation of engineering challenges. In the summer of 1984, a young manufacturing engineer named John Burke took the initiative to organise a meeting of like-minded technical people to address these challenges by sharing their problems and experiences, out of which evolved SMART Group.