Inemi Lead-Free Assembly & Rework Project Results Reported at APEX

摘要

The International Electronics Manufacturing Initiative's (iNEMPs) Lead-Free Assembly & Rework Project was featured as one of the free forums at the IPC Printed Circuit Expo/APEX/Designers Summit conference at the end of February, The project team reported on their three-year collaboration to develop lead-free assembly and rework processes for large, double-sided, thick IPC Class 2 printed wiring boards (PWBs), "This project closely followed the initial work and results developed by the first iNEMI lead-free development team," says Jerry Gleason, R&D engineer for HP and co-chair of the iNEMI project team. "We focused on furthering lead-free process development, including second-level assembly and rework processes. We also evaluated manufacturability, toolsets and components. All assembly and component rework processes were conducted on production equipment to ensure that test results reflected 'real-world' processes."