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Preparation of highly C-axis-oriented PZT films on Si substrate with MgO buffer layer by the sol-gel method

机译:溶胶-凝胶法在具有MgO缓冲层的Si衬底上制备高C轴取向的PZT膜

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摘要

Lead zirconate titanate (Pb(Zi-,Ti)O-3, PZT) thin films have received much attention due to their excellent dielectric, ferroelectric and piezoelectric properties. Epitaxial growth of PZT films on Si substrate is desirable to integrate ferroelectric devices and semiconductor devices on the same substrate. However, epitaxy of PZT films directly on Si substrates is very difficult because of the lattice mismatch between them and the interdiffusion owing to the high growth temperature during deposition. In this paper, we Study the effect of MgO buffer layer and the post-annealing conditions on the C-axis orientation of the PZT films fabricated by the sol-gel method on Si substrate. The experimental results show that if we anneal the PZT films grown on MgO (2 0 0)/Si substrate at 600 degrees C for I h, highly C-axis-oriented PZT films could be obtained. The full width at half maximum intensity (FWH M) of PZT (0 0 1) and PZT (0 0 2) peaks obtained from the X-ray diffraction (XRD) were 0.18 degrees and 0.22 degrees, respectively. The surface roughness of the annealed PZT films was about 3.9 nm. The results could be useful in the integration of ferroelectric devices and semiconductor devices on the same Si substrate. (c) 2007 Elsevier Ltd. All rights reserved.
机译:钛酸锆钛酸铅(Pb(Zi-,Ti)O-3,PZT)薄膜由于其优异的介电,铁电和压电性能而备受关注。为了在同一衬底上集成铁电器件和半导体器件,希望在Si衬底上外延生长PZT膜。然而,由于在沉积期间的高生长温度,直接在Si衬底上的PZT膜的外延非常困难,因为它们之间的晶格失配和相互扩散。在本文中,我们研究了MgO缓冲层和退火后条件对通过溶胶-凝胶法在Si衬底上制备的PZT膜的C轴取向的影响。实验结果表明,如果我们在600摄氏度的温度下对在MgO(2 0 0)/ Si衬底上生长的PZT薄膜进行退火处理1 h,则可以获得高C轴取向的PZT薄膜。通过X射线衍射(XRD)获得的PZT(0 0 1)和PZT(0 0 2)峰的半峰全宽(FWH M)分别为0.18度和0.22度。退火的PZT膜的表面粗糙度为约3.9nm。该结果对于将铁电器件和半导体器件集成在同一Si衬底上可能有用。 (c)2007 Elsevier Ltd.保留所有权利。

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