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Intriguing kinetics for chlorine etching of the Si(100)-(2 * 1) surface

机译:Si(100)-(2 * 1)表面氯蚀刻的有趣动力学

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The desorption kinetics of SiCl_2(g) species from the Cl covered nondefective Si(100)-(2 * 1) surface is investigated. During temperature programmed desorption, an extremely fast SiCl_2(g) desorption with the full width at half maximum of 14 K at 953 K is observed from the superheated Cl saturated Si(100). The coverage-dependent desorption kinetics of SiCl_2(g) follows a second order dependence on the coverage of adsorbed Cl and on the coverage of bare Si sites. The activation barrier and preexponential factor of 197 +- 19 kJ/mole and 5 * 10~(10 +- 1) s~(-1), respectively, are obtained from the model. On the Cl-saturated Si(100) surface, an additional high energy kinetic step is necessary to initiate the SiCl_2(g) desorption since there are not any bare Si sites. As soon as this process turns on, the desorption of SiCl_2(g) occurs catastrophically via the low energy desorption process.
机译:研究了ClCl覆盖的无缺陷Si(100)-(2 * 1)表面对SiCl_2(g)的解吸动力学。在程序升温脱附过程中,从过热的Cl饱和Si(100)观察到极快的SiCl_2(g)脱附,其最大宽度在953 K处最大为14 K的一半。 SiCl_2(g)的取决于覆盖率的解吸动力学遵循二级依赖于吸附的Cl的覆盖率和裸露的Si位点的覆盖率。从模型中获得了197 +-19 kJ / mol的激活势垒和指数前因子和5 * 10〜(10 +1)s〜(-1)。在Cl饱和的Si(100)表面上,由于没有任何裸露的Si位,因此需要额外的高能动力学步骤来引发SiCl_2(g)的解吸。该过程一旦打开,SiCl_2(g)的解吸就会通过低能解吸过程而灾难性地发生。

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