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首页> 外文期刊>Physiology and Molecular Biology of Plants >Effect of annealing temperatures on the structure and leakage mechanisms of BiFe0_3 thin films prepared by the sol-gel method
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Effect of annealing temperatures on the structure and leakage mechanisms of BiFe0_3 thin films prepared by the sol-gel method

机译:退火温度对溶胶-凝胶法制备BiFe0_3薄膜结构和渗漏机理的影响

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In this paper, we report the fabrication of polycrystalline BiFe0_3 (BFO) thin films on Pt(lll)/Ti/ SiO_2/Si(100) substrates by the sol-gel method. The effect of annealing temperature (T_a) on the structural, optical, morphological, ferroelectric andleakage properties of the films were analyzed by X-ray diffraction (XRD), Raman spectroscopy, Atomic force microscope (AFM) and ferroelectric measurements. XRD patterns and micro-Raman spectra demonstrated that all films had a single perovskite-type rhombohedral structure. A distortion in crystal lattice constants and a contraction in unit cell volume were observed with the increase of annealing temperatures. AFM images showed that dense and uniform grains were obtained. This reveals that the film is well crystallized. The data of ferroelectric test indicated that the double remanent polarization (2P_r) value of the thin film at Ta = 600 °C was 22 uC/cm~2 and the leakage current density was 9.0 x 10~(-8) A/cm~2 at an applied electric field of 1.0 x 10~5 V/cm. The leakage mechanisms of thin films have been studied in order to identify the cause of high leakage currents such as Ohmic conduction, the space-charge-limited current, the Schottky emission, the Fowler-Nordheim tunneling and the Poole-Frenkelemission. In low electric field region (<1.0 x 10~5 V/cm), the conduction behavior was found to be dominated by Ohmic conduction for the thin film annealed at 500 °C. The Ohmic conduction and space-charge-limited current dominated the leakage behaviorfor the thin films at T_a = 550 and 600 °C. Fowler-Nordheim tunneling was responsible for the leakage behavior of the thin films at T_a = 550, 600 °C in high electric field region (>1.0 x 10~5 V/cm). The results demonstrated that the microstructure, surface morphology and ferroelectric properties of BFO thin films have a strong dependence on annealing temperatures.
机译:在本文中,我们报道了通过溶胶-凝胶法在Pt(III)/ Ti / SiO_2 / Si(100)衬底上制备多晶BiFe0_3(BFO)薄膜。通过X射线衍射(XRD),拉曼光谱,原子力显微镜(AFM)和铁电测量分析了退火温度(T_a)对薄膜结构,光学,形态,铁电和渗漏性能的影响。 XRD图谱和显微拉曼光谱表明,所有薄膜均具有单一的钙钛矿型菱面体结构。随着退火温度的升高,观察到晶格常数的畸变和晶胞体积的收缩。原子力显微镜图像显示获得了致密均匀的晶粒。这表明该膜结晶良好。铁电测试数据表明,薄膜在Ta = 600°C时的双剩极化(2P_r)值为22 uC / cm〜2,漏电流密度为9.0 x 10〜(-8)A / cm〜。 2在施加的电场为1.0 x 10〜5 V / cm的情况下。为了确定高泄漏电流的原因,例如欧姆传导,空间电荷限制电流,肖特基发射,Fowler-Nordheim隧穿和Poole-Frenkelemission,已经研究了薄膜的泄漏机理。在低电场区域(<1.0 x 10〜5 V / cm)中,发现在500°C退火的薄膜中,导电行为受欧姆导电支配。在T_a = 550和600°C时,薄膜的泄漏行为由欧姆传导和空间电荷限制电流决定。 Fowler-Nordheim隧穿是薄膜在高电场区域(> 1.0 x 10〜5 V / cm)中T_a = 550、600°C时的泄漏行为的原因。结果表明,BFO薄膜的微观结构,表面形貌和铁电性能对退火温度有很大的依赖性。

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