Annealing for thin-film semiconductor structure, annealing method for thin film semiconductor, thin film semiconductor device, thin film semiconductor device manufacturing method, and a display device.

摘要

PROBLEM TO BE SOLVED: To provide a thin-film semiconductor structural body for annealing that can efficiently drop oxygen concentration near the surface of an element formation side of a semiconductor thin film without a special manufacturing process, an annealing method for a thin-film semiconductor, a thin-film semiconductor device, a method for manufacturing the thin-film semiconductor device, and a display device.;SOLUTION: The semiconductor structural body for annealing is provided with an amorphous semiconductor thin film 12 containing oxygen, and a light transmission insulation film 13 that is provided on the surface of an element formation side of the semiconductor thin film 12 and transmits an energy light emitted to the semiconductor thin film 12.;COPYRIGHT: (C)2005,JPO&NCIPI