首页> 外国专利> THIN-FILM SEMICONDUCTOR STRUCTURE FOR ANNEALING, ANNEALING METHOD FOR THE THIN-FILM SEMICONDUCTOR, THIN-FILM SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE THIN-FILM SEMICONDUCTOR DEVICE, AND DISPLAY

THIN-FILM SEMICONDUCTOR STRUCTURE FOR ANNEALING, ANNEALING METHOD FOR THE THIN-FILM SEMICONDUCTOR, THIN-FILM SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE THIN-FILM SEMICONDUCTOR DEVICE, AND DISPLAY

机译:用于退火的薄膜半导体结构,用于薄膜半导体的退火方法,薄膜半导体器件,薄膜半导体器件的制造方法以及显示

摘要

PROBLEM TO BE SOLVED: To efficiently reduce the carbon concentration present in a semiconductor thin film, without requiring special manufacturing processes.;SOLUTION: A thin-film transistor has the amorphous semiconductor thin film, fused and recrystallized by an excimer laser and has an insulating substrate 10 for supporting the semiconductor thin film. Further, the thin-film transistor has an undercoat film 11, formed on the insulating substrate 10 as the foundation of the semiconductor thin film 12 and for so storing therein the carbon penetrating from the side of the insulating substrate 10 as to set the value of its carbon concentration to a value lower than that of the insulating substrate 10.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:在不需要特殊制造工艺的情况下,有效降低半导体薄膜中的碳浓度。;解决方案:薄膜晶体管具有非晶态半导体薄膜,通过准分子激光熔化并重结晶,并且具有绝缘性用于支撑半导体薄膜的衬底10。此外,该薄膜晶体管具有底涂层11,该底涂层11形成在作为半导体薄膜12的基础的绝缘基板10上,并且用于在其中存储从绝缘基板10的侧面穿透的碳以设定其值。碳浓度低于绝缘基板10的碳浓度;版权所有:(C)2005,JPO&NCIPI

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号