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Simultaneous driver and wire sizing for performance and power optimization

机译:同时调整驱动器和导线尺寸,以实现性能和功率优化

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In this paper, we study the simultaneous driver and wire sizing (SDWS) problem under two objective functions: i) delay minimization only, or ii) combined delay and power dissipation minimization. We present general formulations of the SDWS problem under these two objectives based on the distributed Elmore delay model with consideration of both capacitive power dissipation and short-circuit power dissipation. We show several interesting properties of the optimal SDWS solutions under the two objectives, including an important result which reveals the relationship between driver sizing and optimal wire sizing. These results lead to polynomial time algorithms for computing the lower and upper bounds of optimal SDWS solutions under the two objectives, and efficient algorithms for computing optimal SDWS solutions under the two objectives. We have implemented these algorithms and compared them with existing design methods for driver sizing only or independent driver and wire sizing. Accurate SPICE simulation shows that our methods reduce the delay by up to 12%-49% and power dissipation by 26%-63% compared with existing design methods.
机译:在本文中,我们研究了两个目标函数下的同时驱动器和电线尺寸调整(SDWS)问题:i)仅延迟最小化,或ii)组合延迟和功耗最小化。我们基于分布的Elmore延迟模型,在考虑电容性功耗和短路功耗的情况下,针对这两个目标提出了SDWS问题的一般公式。我们在两个目标下展示了最佳SDWS解决方案的一些有趣特性,其中包括一个重要结果,揭示了驱动器尺寸与最佳导线尺寸之间的关系。这些结果导致用于在两个目标下计算最佳SDWS解决方案上下限的多项式时间算法,以及在两个目标下计算最优SDWS解决方案的高效算法。我们已经实现了这些算法,并将它们与仅用于驱动程序大小确定或仅用于独立驱动程序和电线大小确定的现有设计方法进行了比较。精确的SPICE仿真表明,与现有设计方法相比,我们的方法最多可将延迟降低12%-49%,并将功耗降低26%-63%。

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