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Simultaneous driver and wire sizing for performance and poweroptimization

机译:同时调整驱动器和导线尺寸,以实现性能和功率优化

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In this paper, we study the simultaneous driver and wire sizingn(SDWS) problem under two objective functions: i) delay minimizationnonly, or ii) combined delay and power dissipation minimization. Wenpresent general formulations of the SDWS problem under these twonobjectives based on the distributed Elmore delay model withnconsideration of both capacitive power dissipation and short-circuitnpower dissipation. We show several interesting properties of the optimalnSDWS solutions under the two objectives, including an important resultnwhich reveals the relationship between driver sizing and optimal wirensizing. These results lead to polynomial time algorithms for computingnthe lower and upper bounds of optimal SDWS solutions under the twonobjectives, and efficient algorithms for computing optimal SDWSnsolutions under the two objectives. We have implemented these algorithmsnand compared them with existing design methods for driver sizing only ornindependent driver and wire sizing. Accurate SPICE simulation shows thatnour methods reduce the delay by up to 12%-49% and power dissipation byn26%-63% compared with existing design methods
机译:在本文中,我们研究了两个目标函数下的同时驱动器和导线尺寸(SDWS)问题:i)仅使延迟最小化,或ii)使延迟和功耗最小化。在这两个目标下,Wenpresent基于分布式Elmore延迟模型并考虑电容性功耗和短路性功耗的SDWS问题的一般公式。我们在两个目标下显示了optimSDSDWS解决方案的一些有趣的特性,其中包括一个重要的结果,揭示了驱动器尺寸与最佳wirensizing之间的关系。这些结果导致在两个目标下用于计算最佳SDWS解的上下限的多项式时间算法,以及在两个目标下计算最佳SDWSn解的高效算法。我们已经实现了这些算法,并且将它们与现有的设计方法进行了比较,以仅确定驱动器大小或与驱动器大小无关的驱动器大小。精确的SPICE仿真表明,与现有设计方法相比,采用这种方法可以将延迟减少多达12%-49%,将功耗减少了n26%-63%

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