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Effects of inductance on the propagation delay and repeaterinsertion in VLSI circuits

机译:电感对VLSI电路中传播延迟和中继插入的影响

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A closed-form expression for the propagation delay of a CMOS gatendriving a distributed RLC line is introduced that is within 5% ofndynamic circuit simulations for a wide range of RLC loads. It is shownnthat the error in the propagation delay if inductance is neglected andnthe interconnect is treated as a distributed RC line can be over 35% forncurrent on-chip interconnect. It is also shown that the traditionalnquadratic dependence of the propagation delay on the length of theninterconnect for RC lines approaches a linear dependence as inductanceneffects increase. On-chip inductance is therefore expected to have anprofound effect on traditional high-performance integrated circuit (IC)ndesign methodologies. The closed-form delay model is applied to thenproblem of repeater insertion in RLC interconnect. Closed-form solutionsnare presented for inserting repeaters into RLC lines that are highlynaccurate with respect to numerical solutions. RC models can createnerrors of up to 30% in the total propagation delay of a repeater systemnas compared to the optimal delay if inductance is considered. The errornbetween the RC and RLC models increases as the gate parasitic impedancesndecrease with technology scaling. Thus, the importance of inductance innhigh-performance very large scale integration (VLSI) designnmethodologies will increase as technologies scale
机译:引入了封闭式形式的CMOS门驱动一条分布式RLC线的传播延迟,该表达式在宽范围的RLC负载的动态电路仿真的5%之内。结果表明,对于片上电流互连,如果忽略电感并且将互连视为分布式RC线路,则传播延迟的误差可能超过35%。还显示出,随着电感效应的增加,RC线路的传播延迟对互连长度的传统二次关系接近线性关系。因此,片上电感有望对传统的高性能集成电路(IC)ndesign方法产生深远的影响。然后将封闭形式的延迟模型应用于RLC互连中中继器插入的问题。提出了封闭形式的解决方案,用于将中继器插入相对于数值解决方案高度精确的RLC线中。与考虑电感时的最佳延迟相比,RC模型可以在转发器系统的总传播延迟中产生高达30%的误差。 RC和RLC模型之间的误差随栅极寄生阻抗随技术缩放而减小。因此,随着技术规模的扩大,电感在高性能超大规模集成电路(VLSI)设计方法中的重要性将日益提高。

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