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Crosstalk modeling for coupled RLC interconnects with application to shield insertion

机译:耦合RLC互连的串扰建模及其在屏蔽层插入中的应用

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摘要

On-chip interconnect delay and crosstalk noise have become significant bottlenecks in the performance and signal integrity of deep submicrometer VLSI circuits. A crosstalk noise model for both identical and nonidentical coupled resistance-inductance-capacitance (RLC) interconnects is developed based on a decoupling technique exhibiting an average error of 6.8% as compared to SPICE. The crosstalk noise model, together with a proposed concept of effective mutual inductance, is applied to evaluate the effectiveness of the shielding technique.
机译:片上互连延迟和串扰噪声已成为深亚微米VLSI电路的性能和信号完整性的重要瓶颈。基于去耦技术,开发了用于相同和不同耦合电阻-电感-电容(RLC)互连的串扰噪声模型,与SPICE相比,该技术的平均误差为6.8%。串扰噪声模型与提出的有效互感概念一起用于评估屏蔽技术的有效性。

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