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A 11-Transistor Nanoscale CMOS Memory Cell for Hardening to Soft Errors

机译:用于硬化软错误的11晶体管纳米级CMOS存储单元

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摘要

This paper proposes a new hardening design for an 11 transistors (11T) CMOS memory cell at 32 nm feature size. The proposed hardened memory cell overcomes the problems associated with the previous design by utilizing novel access and refreshing mechanisms. Simulation shows that the data stored in the proposed hardened memory cell does not change even for a transient pulse of more than twice the charge than a conventional memory cell. Moreover it achieves 55% reduction in power delay product compared to the DICE cell (with 12 transistors) providing a significant improvement in soft error tolerance. Simulation results are provided using the predictive technology file for 32 nm feature size in CMOS.
机译:本文针对特征尺寸为32 nm的11个晶体管(11T)CMOS存储单元提出了一种新的加固设计。所提出的硬化存储单元通过利用新颖的访问和刷新机制克服了与先前设计相关的问题。仿真表明,即使是比传统存储单元电荷大两倍的瞬态脉冲,存储在建议的硬化存储单元中的数据也不会改变。此外,与DICE单元(具有12个晶体管)相比,它可将功率延迟乘积降低55%,从而显着改善了软错误容限。使用预测技术文件提供了针对CMOS中32 nm特征尺寸的仿真结果。

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