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McPAT-PVT: Delay and Power Modeling Framework for FinFET Processor Architectures Under PVT Variations

机译:McPAT-PVT:PVT变化下用于FinFET处理器架构的延迟和功率建模框架

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As technology has moved into the deep-submicrometer regime, the shrinking feature size has placed a considerable stress on CMOS fabrication due to short-channel effects (SCEs) and excessive leakage. Although many research efforts have been devoted to seeking system-level solutions, underlying transistor-level solutions are still urgently required to overcome these obstacles. FinFETs have emerged as promising substitutes for conventional CMOS due to their superior control of SCEs and process scalability. However, FinFETs still face lithographic and workfunction engineering challenges, in addition to those posed by supply voltage and temperature variations across the integrated circuit (IC). These lead to process, supply voltage, and temperature (PVT) variations in FinFET ICs, which, in turn, lead to large spreads in delay and leakage. In this paper, we present a multicore power, area, and timing (McPAT)-PVT, an integrated framework for the simulation of power, delay, as well as PVT variations of FinFET-based processors. McPAT-PVT uses a FinFET design library, consisting of logic and memory cells, to model circuit-level characteristics as well as their PVT variation trends. It is based on macromodels, derived from very accurate TCAD device simulations that characterize various functional units in a processor under PVT variations, making yield analysis for timing and power for processor components possible. McPAT-PVT can model both shorted-gate (SG) and asymmetric-workfunction shorted-gate (ASG) FinFET-based processors. Combining these macromodels with a FinFET-based CACTI-PVT cache model and an ORION-PVT on-chip network model, McPAT-PVT is able to simulate a delay and power consumption of all processor components under PVT variations. We present extensive simulation results to demonstrate its efficacy, including for an alpha-like processor and multicore simulations based on Princeton Application Repository for Shared-Memory Computers benchmarks. Results show that the- ASG FinFET-based processor implementation has lower leakage power and lower total power relative to the SG FinFET-based processor implementation for the same performance, with <1% area penalty.
机译:随着技术进入深亚微米范围,缩小的特征尺寸由于短沟道效应(SCE)和过多的泄漏而给CMOS制造带来相当大的压力。尽管已经进行了许多研究工作以寻求系统级解决方案,但是仍然迫切需要基础晶体管级解决方案来克服这些障碍。 FinFET由于具有出色的SCE控制能力和工艺可扩展性,已经成为传统CMOS的有希望的替代品。然而,除了由集成电路(IC)上的电源电压和温度变化所带来的挑战之外,FinFET仍然面临光刻和功函数工程挑战。这些会导致FinFET IC中的工艺,电源电压和温度(PVT)变化,进而导致延迟和泄漏的大范围扩展。在本文中,我们介绍了多核功率,面积和时序(McPAT)-PVT,这是一个用于仿真基于FinFET的处理器的功率,延迟以及PVT变化的集成框架。 McPAT-PVT使用由逻辑和存储单元组成的FinFET设计库来对电路级特性及其PVT变化趋势进行建模。它基于宏模型,该宏模型是从非常精确的TCAD设备仿真得出的,该仿真在PVT变化下表征了处理器中的各种功能单元,从而可以对处理器组件的时序和功耗进行成品率分析。 McPAT-PVT可以对基于FinFET的短门(SG)和不对称功函数短门(ASG)进行建模。将这些宏模型与基于FinFET的CACTI-PVT缓存模型和ORION-PVT片上网络模型相结合,McPAT-PVT能够模拟PVT变化时所有处理器组件的延迟和功耗。我们提供了广泛的仿真结果来证明其功效,包括基于共享存储计算机基准的Princeton Application Repository的类似alpha处理器和多核仿真。结果表明,与基于SG FinFET的处理器实现相同的性能相比,基于ASG FinFET的处理器实现具有更低的泄漏功率和更低的总功率,且面积损失小于1%。

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