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Thin film silicon substrate formation using electrochemical anodic etching method

机译:利用电化学阳极蚀刻法形成薄膜硅基板

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The production of detached porous silicon (PS) layers for layer transfer (LT) has been investigated. Electrochemical anodisation (ECA) studies of monocrystalline silicon (mono-Si) wafers in a hydrofluoric acid/ethanol/deionised (DI) water solution showed that porosity can be controlled by controlling current density during ECA. Double layered PS layers consisting of low (26·5%) and high (86·3%) porosity layers were formed by ECA at 1·5 mA cm-2 and 100 mA cm-2 for etching times of 10 min and 10 sec respectively. These PS layers are considered viable for LT substrate technology.
机译:已经研究了用于层转移(LT)的分离的多孔硅(PS)层的生产。在氢氟酸/乙醇/去离子(DI)水溶液中对单晶硅(mono-Si)晶片的电化学阳极氧化(ECA)研究表明,可以通过控制ECA期间的电流密度来控制孔隙率。通过ECA在1·5 mA cm -2 和100 mA cm -下形成由低孔隙率层(26·5%)和高孔隙率层(86·3%)组成的双层PS层2 分别表示10分钟和10秒的蚀刻时间。这些PS层被认为可用于LT基板技术。

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  • 来源
    《Surface Engineering》 |2009年第8期|603-605|共3页
  • 作者

    Kwon J.-H.; Lee S.-H.; Ju B.-K.;

  • 作者单位

    Display and Nanosystem Laborotory, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-701, Korea;

    Strategic Energy Research Institute, Sejong University, 98 Kunja-Dong, Kwangin-Gu Seoul 143-747, Korea;

    School of Electrical Engineering, College of Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-701, Korea, Email: bkju@korea.ac.kr;

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