首页> 外文期刊>Superlattices and microstructures >A two-dimensional (2D) analytical subthreshold swing and transconductance model of underlap dual-material double-gate (DMDG) MOSFET for analog/RF applications
【24h】

A two-dimensional (2D) analytical subthreshold swing and transconductance model of underlap dual-material double-gate (DMDG) MOSFET for analog/RF applications

机译:用于模拟/ RF应用的重叠双材料双栅极(DMDG)MOSFET的二维(2D)分析亚阈值摆幅和跨导模型

获取原文
获取原文并翻译 | 示例
           

摘要

The double-gate (DG) metal-oxide-semiconductor field effect transistors (MOSFETs) are the choice of technology in sub -100 nm regime of leading microelectronics industry. To enhance the analog and RF performance of DG MOSFET, an underlap dual-material (DM) DG MOSFET device structure has been considered because, it has the advantages of both underlap as well as that of dual-material gate (DMG). A 2D analytical surface potential, subthreshold current, subthreshold swing as well as transconductance modelling of underlap DMDG MOSFET has been done by solving the Poisson's equation. It has also been found that, numerically simulated data approves the analytically modelled data with commendable accuracy. As underlap length (L_(un)) increases, a substantial reduction of subthreshold current due to enhanced gate control over channel regime is observed. DMG structure facilitates to improve the average velocity of carriers which leads to superior drive current of the device. The underlap DMDG MOSFET device structure demonstrates an ameliorated subthreshold characteristic. The analog figure of merits (FOMs) such as transconductance (g_m), transconductance generation factor (TGF), output conductance (g_d), early voltage (V_(EA)). intrinsic gain (A_V) and RF FOMs namely cut-off frequency (f_T), gain frequency product (GFP), transconductance frequency product (TFP) and gain transconductance frequency product (GTFP) have been evaluated. The aforesaid analysis revels that, the device is best suited for communication related Analog/RF applications.
机译:双栅极(DG)金属氧化物半导体场效应晶体管(MOSFET)是领先的微电子工业中低于-100 nm的技术选择。为了增强DG MOSFET的模拟和RF性能,已经考虑了下重叠双材料(DM)DG MOSFET器件结构,因为它具有下重叠和双材料栅极(DMG)的优点。通过求解泊松方程,完成了二维分析表面电势,亚阈值电流,亚阈值摆幅以及下叠式DMDG MOSFET的跨导建模。还发现,数值模拟数据以可称的准确性批准了分析模型数据。随着重叠长度(L_(un))的增加,观察到由于增强了对沟道状态的栅极控制而导致的亚阈值电流的大幅降低。 DMG结构有助于提高载流子的平均速度,从而导致器件具有出色的驱动电流。叠底DMDG MOSFET器件结构显示出改善的亚阈值特性。优值(FOM)的模拟值,例如跨导(g_m),跨导生成因子(TGF),输出电导(g_d),早期电压(V_(EA))。已经评估了固有增益(A_V)和RF FOM,即截止频率(f_T),增益频率乘积(GFP),跨导频率乘积(TFP)和增益跨导频率乘积(GTFP)。上述分析表明,该器件最适合与通信相关的Analog / RF应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号