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A 256-kb 65-nm Sub-threshold SRAM Design for Ultra-Low-Voltage Operation

机译:用于超低压操作的256kb 65nm亚阈值SRAM设计

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Low-voltage operation for memories is attractive because of lower leakage power and active energy, but the challenges of SRAM design tend to increase at lower voltage. This paper explores the limits of low-voltage operation for traditional six-transistor (6T) SRAM and proposes an alternative bitcell that functions too much lower voltages. Measurements confirm that a 256-kb 65-nm SRAM test chip using the proposed bitcell operates into sub-threshold to below 400 mV. At this low voltage, the memory offers substantial power and energy savings at the cost of speed, making it well-suited to energy-constrained applications. The paper provides measured data and analysis on the limiting effects for voltage scaling for the test chip
机译:由于较低的泄漏功率和有功电能,存储器的低电压操作很有吸引力,但是SRAM设计的挑战往往在低电压下会增加。本文探讨了传统六晶体管(6T)SRAM的低电压操作的局限性,并提出了一种替代的位单元,该单元的电压要低得多。测量结果证实,使用建议的位单元的256-kb 65-nm SRAM测试芯片可将亚阈值降至低于400 mV。在这种低电压下,该存储器以速度为代价提供了可观的功率和能量节省,使其非常适合于能量受限的应用。本文提供了测量数据并分析了测试芯片的电压缩放限制效应

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