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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Analysis of the Influence of Substrate on the Performance of On-Chip MOS Decoupling Capacitors
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Analysis of the Influence of Substrate on the Performance of On-Chip MOS Decoupling Capacitors

机译:衬底对片上MOS去耦电容器性能的影响分析

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摘要

The interaction between substrate and devices is normally neglected during the design of on-chip MOS decoupling capacitors (decaps). However, it may significantly influence the decap performance to reduce high-frequency power supply noise. In this paper we propose a novel six-parameter analytical decap model which accounts for substrate and device interactions. Our model has been compared against state-of-the-art decap models. Moreover, it has been extensively validated through simulations and measurements. For 65 nm LP-CMOS, a close correlation has been obtained over a large frequency range from 10 MHz up to 10 GHz. Furthermore, we introduce the maximum decap admittance as a new metric for decap performance qualification. Closed-form expressions have been derived to calculate maximum admittance. Finally, we determine the relationship between relevant figure-of-merit parameters for decap design optimization.
机译:在设计片上MOS去耦电容器(去电容)时,通常会忽略衬底与器件之间的相互作用。但是,它可能会严重影响decap的性能以降低高频电源噪声。在本文中,我们提出了一种新颖的六参数分析开盖模型,该模型考虑了基板和器件之间的相互作用。我们的模型已经与最新的decap模型进行了比较。而且,它已经通过仿真和测量得到了广泛的验证。对于65 nm LP-CMOS,已在10 MHz至10 GHz的较大频率范围内获得了紧密的相关性。此外,我们引入了最大开盖准入率作为开盖性能合格性的新指标。已得出闭合形式的表达式以计算最大导纳。最后,我们确定了用于顶盖设计优化的相关品质因数参数之间的关系。

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