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High performance power distribution networks with on-chip decoupling capacitors for nanoscale integrated circuits

机译：具有用于纳米级集成电路的片上去耦电容器的高性能配电网络

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作者
Popovich, Mikhail;
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作者单位

University of Rochester;

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授予单位 University of Rochester;
学科
学位 Ph.D.
年度 2008
页码 342 p.
总页数 342
原文格式 PDF
正文语种 eng
中图分类
关键词
入库时间 2022-08-17 11:57:36

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1. Supply Noise and Impedance of On-Chip Power Distribution Networks in ICs With Nonuniform Power Consumption and Interblock Decoupling Capacitors [J] . Rius Josep Very Large Scale Integration (VLSI) Systems, IEEE Transactions on . 2015,第6期

机译：具有不均匀功耗和块间去耦电容的IC中片上配电网络的电源噪声和阻抗
2. Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects [J] . Kim K., Hwang C., Koo K., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2012,第12期

机译：基于TSV的3-D存储器IC（包括P / G TSV，片上去耦电容器和硅衬底效应）中配电网络的建模和分析
3. On-Chip Power Distribution Grids With Multiple Supply Voltages for High-Performance Integrated Circuits [J] . Popovich M., Friedman E. G., Sotman M., IEEE transactions on very large scale integration (VLSI) systems . 2008,第7期

机译：具有多个电源电压的片上配电网格，用于高性能集成电路
4. Effects of on-chip decoupling capacitors and silicon substrate on power distribution networks in TSV-based 3D-ICs [C] . Kim Kiyeong, Pak Jun So, Lee Hyungdong, Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd . 2012

机译：基于TSV的3D-IC中片上去耦电容器和硅衬底对配电网络的影响
5. Effective distance calculations for on-chip decoupling capacitors in 3-D integrated circuits. [D] . Mungi, Sateja Sunil. 2013

机译：3-D集成电路中片上去耦电容器的有效距离计算。
6. Nanoscale on-chip all-optical logic parity checker in integrated plasmonic circuits in optical communication range [O] . Feifan Wang, Zibo Gong, Xiaoyong Hu, -1

机译：集成等离子电路中光通信范围内的纳米级片上全光逻辑奇偶校验器
7. On-chip power distribution grids with multiple supply voltages for high performance integrated circuits [O] . Mikhail Popovich, Eby G. Friedman, Michael Sotman, 2005

机译：具有多个电源电压的片上配电网，用于高性能集成电路

High performance power distribution networks with on-chip decoupling capacitors for nanoscale integrated circuits

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