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Si-Sb-Te films for phase-change random access memory

机译:用于相变随机存取存储器的Si-Sb-Te膜

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Electrical properties and crystallization behaviour of Si-Sb-Te films were studied and compared with those of a Ge_2Sb_2Te_5 film. The resistivity ratio of Si-Sb-Te films can reach 10~6 during the amorphous-crystalline transition, accompanied with a small thickness change (less than 3%). The melting temperature of Si-Sb-Te films is lower than that of a Ge_2Sb_2Te_5 film. Furthermore, the switching characteristics of the device using a Si_(10.7)Sb_(39.5)Te_(49.8) film were also studied. The device can be successfully switched with a 4 V, 100 ns pulse for SET operation and a 5 V, 40 ns pulse for RESET operation. A small RESET current and low power consumption can be obtained, which may be attributed to the low melting temperature and the high crystalline resistivity of Si-Sb-Te films. These results indicate the feasibility of Si-Sb-Te films in the application of phase-change random access memory.
机译:研究了Si-Sb-Te薄膜的电学性质和结晶行为,并与Ge_2Sb_2Te_5薄膜的电学性质和结晶行为进行了比较。 Si-Sb-Te薄膜的电阻率在非晶-晶态转变过程中可达到10〜6,厚度变化小(小于3%)。 Si-Sb-Te薄膜的熔化温度低于Ge_2Sb_2Te_5薄膜的熔化温度。此外,还研究了使用Si_(10.7)Sb_(39.5)Te_(49.8)膜的器件的开关特性。可以通过4 V,100 ns的脉冲(用于SET操作)和5 V,40 ns的脉冲(用于RESET操作)成功切换该器件。可以获得小的RESET电流和低功耗,这可以归因于Si-Sb-Te膜的低熔化温度和高结晶电阻率。这些结果表明Si-Sb-Te膜在相变随机存取存储器中的应用可行性。

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