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Admittance of metal-insulator-semiconductor devices based on HgCdTe nBn structures

机译:基于HGCDTE NBN结构的金属绝缘体 - 半导体器件的承载

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Metal-insulator-semiconductor (MIS) structures were fabricated by depositing an Al2O3 dielectric on top of the contact layer of a mid-wave infrared nBn detector based on n-Hg1-xCdxTe grown by molecular beam epitaxy on GaAs (013) substrates. It is shown that when creating a backward electrode on the absorbing layer, the form of the capacitance-voltage characteristics depends not only on the properties of the contact layer, but also on the properties of the barrier and absorbing layers. An equivalent circuit of MIS structure based on nBn detector with mesa configuration is proposed. It is shown that measurements of the admittance of MIS structures with mesa configuration allow one to study the properties of the barrier layer in the nBn structure. The influence of infrared radiation on the temperature dependence of the barrier layer resistance is studied.
机译:通过基于通过在GaAs(013)基板上的分子束外延生长的N-HG1-XCDXTE在中波红外NBN检测器的接触层的顶部上沉积金属 - 绝缘体 - 半导体(MIS)结构。结果表明,当在吸收层上产生后向电极时,电容电压特性的形式不仅取决于接触层的性质,而且还取决于屏障和吸收层的性质。提出了一种基于具有MESA配置的NBN检测器的MIS结构等效电路。结果表明,测量MIS结构与MESA配置允许人们研究NBN结构中的阻挡层的性质。研究了红外辐射对阻挡层电阻的温度依赖性的影响。

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