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Anisotropic lateral oxidation of Al-Ⅲ-Ⅴ semiconductors: inverse problem and circular aperture fabrication

机译:Al-Ⅲ-Ⅴ半导体的各向异性横向氧化:反问题和圆孔制造

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摘要

The lateral wet oxidation of aluminum-containing III-V-semiconductors is a technological process which converts a buried (thin) cristalline material into an amorphous insulator and, as such, tends to exhibit an anisotropic behavior. As a result, the shape of the interface between the semiconductor and the insulator, often referred as the oxide aperture, differs from the etched mesa contour from which the oxidation proceeds. This, in turn, complicates the design of the devices relying on this process especially when specific oxide patterns are needed. In this paper, we introduce a method based on a morphological dilatation to determine the shape of the mesas which will lead to a specific targetted contour upon an anisotropic oxidation over a modest extent. The approach is experimentally validated by demonstrating the fabrication of circular oxide apertures which are inherently difficult to make because of their high degree of symmetry but which also turn out to be of critical importance in obtaining efficient single-mode vertical-cavity surface-emittting lasers.
机译:含铝的III-V族半导体的横向湿式氧化是将掩埋的(薄的)晶体材料转换为非晶绝缘体的技术过程,因此倾向于表现出各向异性行为。结果,半导体和绝缘体之间的界面的形状,通常称为氧化物孔,不同于进行氧化的蚀刻台面轮廓。反过来,这使依赖于此工艺的器件的设计复杂化,尤其是在需要特定的氧化物图案时。在本文中,我们介绍了一种基于形态学膨胀的方法来确定台面的形状,这种形状将在中等程度的各向异性氧化作用下导致特定的目标轮廓。通过证明圆形氧化物孔的制造,该方法在实验上得到了验证,圆形孔由于其高度的对称性而固有地难以制造,但是对于获得有效的单模垂直腔面发射激光器来说,这也至关重要。

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