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Design and Simulation of Silicon-based NiCrAu MEMS Torsion Micromirror with Tilted Back-electrode

机译:倾斜电极的硅基NiCrAu MEMS扭转微镜的设计与仿真

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摘要

Torsion micromirror is a key structure of optical devices in micro-electro-mechanical system (MEMS), such as MEMS optical switches, MEMS variable optical attenuator, MEMS scanning micromirror array and so on. A silicon-based NiCrAu MEMS torsion micromirror is theoretically analyzed. It is shown that in order to have 15° rotation, the driven voltage should be about 20 V and the thickness of the supporting beam must be controlled in the range of submicron orders of magnitude. This very thin beam makes the structure more unstable and unreliable, and also makes the fabrication more complicated. Based on parallel back-electrode analysis and testing, a tilted back-electrode has been designed to replace the parallel back-electrode in order to decrease the driven voltage and difficulty of fabricating processing. By theoretical analysis and simulation, a conclusion can be drown that the thickness can be improved from submicron to micron by using tilted back-electrode when using the same driven voltage. Tilted back-electrode is very effective to improve the stability and reliability of the micromirror structure.
机译:扭转微镜是微机电系统(MEMS)中光学器件的关键结构,例如MEMS光开关,MEMS可变光衰减器,MEMS扫描微镜阵列等。理论上分析了硅基NiCrAu MEMS扭转微镜。结果表明,要使其旋转15°,驱动电压应约为20 V,并且支撑梁的厚度必须控制在亚微米数量级的范围内。这种非常细的光束使结构更加不稳定和不可靠,并使制造更加复杂。基于平行背电极的分析和测试,已经设计了倾斜的背电极来代替平行背电极,以降低驱动电压和制造工艺的难度。通过理论分析和模拟,可以得出结论,当使用相同的驱动电压时,通过使用倾斜的背电极可以将厚度从亚微米提高到微米。倾斜的背电极对于提高微镜结构的稳定性和可靠性非常有效。

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