More designs will include stacked packages in coming years, according to the latest research. Stacked packages will experience a 13.7% compound annual growth rate from 2011 through 2016, says New Venture Research (newventureresearch.com), while system-in-package (SiP) will have a unit growth rate of 13% CAGR through 2012. Fan-in QFN and fan-in QFP types of electronics components will see unit growth of 38.6% compounded annually between 2011 and 2016, and fan-in WLPs will experience an 11.6% CAGR through 2016, says the firm.
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机译：根据最新研究，未来几年将有更多设计包括堆叠式包装。 New Venture Research（newventureresearch.com）表示，从2011年到2016年，堆叠式包装的复合年增长率将达到13.7％，而系统级包装（SiP）的复合年增长率将在2012年达到13％。Fan-该公司表示，在2011年至2016年之间，QFN和扇入式QFP类型的电子元件的单位复合年增长率将达到38.6％，扇入式WLP的复合年增长率将达到11.6％。
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