Method for chemical decapsulation of electronic components in SOT, VTLA, QFP and QFN casings

摘要

method of chemical dekapsulacji electronic components type sot, vtla, qfp and qfn is that the process is carried out in two stages. in the first stage of electronic sub assembly digests in the mixture of sulphuric acid and hydrogen peroxide (30%) in the ratio of 20: 1 or 10: 1, in time for 30 seconds to 1 minute at a temperature of 120 to 150u00b0c.in the second stage subassembly electronic rinses in the solution containing acetone, appendix tolytriazolu as corrosion inhibitor at a concentration of 5 mg / dm3 of acetone. both processes are alternately until the unveiling of the internal elements of the component.