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首页> 外文期刊>Physical review >Thermal conductivity of Si_(1-x)Ge_x/Si_(1-y)Ge_y, superlattices: Competition between interfacial and internal scattering
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Thermal conductivity of Si_(1-x)Ge_x/Si_(1-y)Ge_y, superlattices: Competition between interfacial and internal scattering

机译:Si_(1-x)Ge_x / Si_(1-y)Ge_y,超晶格的热导率:界面散射与内部散射之间的竞争

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摘要

We investigate thermal transport in Si/Ge and Si_(1-x)Ge_x/Si_(1-y)Ge_y alloy superlattices based on solving the single-mode phonon Boltzmann transport equation in the relaxation-time approximation and with full phonon dispersions. We derive an effective interface scattering rate that depends both on the interface roughness (captured by a wave-vector-dependent specularity parameter) and on the efficiency of internal scattering mechanisms (mass-difference and phonon-phonon scattering). We provide compact expressions for the calculations of in-plane and cross-plane thermal conductivities in superlattices. Our numerical results accurately capture both the observed increase in thermal conductivity as the superlattice period increases and the in-plane vs cross-plane anisotropy of thermal conductivity. Owing to the combined effect of interface and internal scattering, an alloy/alloy superlattice has a lower thermal conductivity than bulk SiGe with the same alloy composition. Thermal conductivity can be minimized by growing short-period alloy/alloy superlattices or Si/Si_(1-x)Ge_x, superlattices with the SiGe layer thicker than the Si one.
机译:我们基于松弛时间近似和全声子色散求解单模声子玻尔兹曼输运方程,研究了Si / Ge和Si_(1-x)Ge_x / Si_(1-y)Ge_y合金超晶格中的热输运。我们得出一个有效的界面散射速率,该速率既取决于界面粗糙度(由依赖于波矢量的镜面度参数捕获),也取决于内部散射机制的效率(质量差和声子-声子散射)。我们提供了用于计算超晶格中面内和跨面热导率的紧凑表达式。我们的数值结果准确地捕获了随着超晶格周期的增加所观察到的热导率的增加,以及热导率的面内与横断面各向异性。由于界面和内部散射的共同作用,合金/合金超晶格的导热率比具有相同合金成分的块状SiGe的导热率低。通过生长短周期的合金/合金超晶格或Si / Si_(1-x)Ge_x(SiGe层比Si层厚的超晶格)可以使导热系数最小化。

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  • 来源
    《Physical review》 |2013年第15期|155318.1-155318.11|共11页
  • 作者

    Z. Aksamija; I. Knezevic;

  • 作者单位

    Department of Electrical and Computer Engineering, University of Massachusetts-Amherst, Amherst, Massachusetts 01003-9292, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706-1691, USA;

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